Engineering Intelligent Products and Systems

Oct
31

Engineering Intelligent Products and Systems

Tom Beckley, Cadence

3:30 p.m., October 31, 2024   |   131 DeBartolo Hall

From the design of semiconductors to AI-enabled intelligent products and systems, Cadence’s Senior VP of R&D will provide a panoramic overview of the world’s rapidly changing technology landscape, and how companies like Cadence can provide unique career opportunities for engineers, computer scientists, physicists, mathematicians and more.

Tom Beckley

Tom Beckley,
Cadence

Tom Beckley has served as Senior Vice President and General Manager of the Custom IC and PCB Group (CPG) of Cadence since 2018, including responsibilities for IC packaging and system analysis. Since he joined Cadence in 2004, the group has commercialized multiple next-generation design technologies in analog, mixed-signal, RF, photonics, and wafer-level advanced packaging, and expanded into system analysis and circuit verification.

Mr. Beckley joined Cadence via the acquisition of Neolinear, a technology spin-out of Carnegie Mellon University. At Neolinear, he served as president and CEO. Prior to that, he was head of the Systems Division at Avant! Corporation, president and CEO of Xynetix, and held engineering and management positions at Harris Corporation and General Motors.

Mr. Beckley received his bachelor’s in mathematics and physics from Kalamazoo College and an MBA from Vanderbilt University.